MEMS Foundry Capabilities
Rogue Valley Microdevices provides integrated MEMS foundry capabilities that support device development from early process exploration through scalable manufacturing. Our engineering team combines thin film deposition, photolithography, etching, wafer processing, and process integration expertise to help customers develop reliable MEMS and semiconductor devices with a clear path toward production.
We operate our MEMS fabrication and wafer processing services in-house using production-capable equipment and controlled manufacturing processes. This integrated approach helps reduce development risk, improve process consistency, and accelerate technology transfer from prototype to manufacturing.
Our capabilities support applications across MEMS sensors, microfluidics, photonics, specialty semiconductor devices, and advanced silicon-based technologies.
Integrated MEMS Process Development
Successful MEMS manufacturing requires more than individual process steps. Our engineering team works collaboratively with customers to align materials, process integration, and manufacturing strategy from the beginning of development.
Rogue Valley Microdevices supports:
- MEMS process development
- Prototype fabrication
- Process optimization
- Design-for-manufacturing collaboration
- Scalable production pathways
By combining foundry expertise with practical manufacturing knowledge, we help customers reduce process risk and move efficiently from concept to production.
U.S.-Based MEMS Foundry Services
Rogue Valley Microdevices operates as a U.S.-based pure-play MEMS foundry supporting customers across healthcare, industrial sensing, aerospace and defense, photonics, communications, and advanced electronics markets.
Our collaborative engineering approach helps customers develop manufacturable MEMS technologies while strengthening domestic supply chain resilience and enabling long-term production scalability.
Comprehensive MEMS Foundry Capabilities That Scale with Your Project
Our advanced MEMS foundry provides a broad portfolio of front-end wafer processing capabilities designed to support complex MEMS devices across multiple industries and applications. Whether you are developing a MEMS prototype, qualifying a new sensor platform, or preparing for high-volume production, our MEMS foundry services are engineered to scale with your technical and commercial requirements.
We support multiple wafer sizes and diverse MEMS device architectures through adaptable tool sets, configurable process modules, and repeatable manufacturing workflows. Our MEMS wafer processing capabilities include deposition, dry etch, wet etch, lithography, and other critical microfabrication processes required for precision MEMS manufacturing.
Foundry-Informed MEMS Design Support
Customers developing new MEMS devices can also engage our MEMS Design Services team for foundry-informed device development, process integration, and technology transfer support.
By aligning device design with scalable fabrication processes early in development, Rogue Valley Microdevices helps reduce manufacturing risk, improve process compatibility, and accelerate the path from concept to production.
Thin Film Deposition
Thin films form the functional foundation of many MEMS and semiconductor devices. Rogue Valley Microdevices provides multiple thin film deposition processes that support electrical isolation, structural layers, sensing elements, optical performance, and surface protection.
Our thin film capabilities include:
- Thermal oxide growth
- LPCVD polysilicon deposition
- LPCVD silicon nitride deposition
- PECVD dielectric films
- Metal deposition on silicon wafers
Engineers integrate these materials into complete fabrication flows designed around device performance, manufacturability, and long-term process stability.
Photolithography
Photolithography defines the microscale features required for MEMS fabrication and semiconductor wafer processing. Our foundry supports precision lithography processes used to pattern thin films, define device structures, and enable subsequent etching or deposition operations.
Our photolithography capabilities support:
- MEMS sensor fabrication
- Thin film patterning
- Alignment for multi-layer processing
- Wafer-level process development
- Prototype and production wafer fabrication
By combining photolithography with integrated process development, Rogue Valley Microdevices supports scalable MEMS manufacturing workflows optimized for precision, repeatability, and manufacturability. Photolithography processes are commonly integrated with Thin Film Deposition, Dry Etch, and Metal Lift-Off capabilities to support complete MEMS device fabrication flows.
Dry Etching and DRIE
Dry etching enables precise material removal for MEMS fabrication, semiconductor processing, and advanced wafer structuring. Rogue Valley Microdevices performs plasma dry etching and Deep Reactive Ion Etch (DRIE) processes that support high-aspect-ratio silicon features and precision wafer shaping.
Our dry etch capabilities support:
- Trenches and cavities
- Through-wafer vias
- High-aspect-ratio MEMS structures
- Thin film pattern transfer
- Silicon micromachining
All dry etch processes operate in-house as part of our integrated MEMS fabrication platform, ensuring strong process control and reliable wafer-to-wafer consistency. Our foundry supports precision lithography processes used to pattern thin films, define device structures, and enable subsequent etching or deposition operations.
Wet Etching
Wet etching provides selective material removal for silicon micromachining, MEMS structures, and surface engineering applications. Our engineers use controlled anisotropic and isotropic wet etch processes to support device fabrication and process development.
Wet etching capabilities include:
- KOH silicon etching
- TMAH silicon etching
- Oxide and nitride masking integration
- Surface preparation and cleaning
- MEMS cavity formation
These processes support both standalone wafer services and fully integrated MEMS manufacturing flows.
Lift-Off Processing
Lift-off processing provides an alternative patterning method when conventional etching is not suitable for sensitive metals or specialized device structures. Rogue Valley Microdevices combines optimized lithography and deposition techniques to produce clean, accurate metal patterns while protecting underlying layers.
Lift-off capabilities support:
- Platinum patterning
- Gold and specialty metal structures
- Thin film device fabrication
- MEMS electrodes and interconnects
- Semiconductor research and prototyping
This process helps engineers create complex metal features while maintaining strong dimensional control and wafer-level uniformity.