PVD Metals and Dielectric Film Deposition
Whether you need a blanket metal deposition on silicon wafers or a metal mask layer, we have your solution. Offering both PVD sputter and E-beam evaporation services from our MEMS Foundry allows us to develop a custom process to meet your needs. Need a metal anneal? Include this in your wafer services request for a quote. In MEMS fabrication, metals play a vital role in device performance.
“We offer high-purity
ultra-clean conductive and dielectric PVD film deposition on silicon wafers for MEMS and Sensor fabrication.”
PVD Metal and Dielectric film Deposition Services
Metal Deposition on Silicon Wafers for MEMS and Semiconductor Devices is fundamental for MEMS fabrication processes.
Conductive films play a critical role in the performance, reliability, and electrical functionality of modern MEMS devices, sensors, and semiconductor components. At Rogue Valley Microdevices, we specialize in precision metal deposition on silicon wafers, supporting advanced MEMS fabrication and semiconductor device manufacturing.
Our MEMS foundry services enable engineers to deposit high-quality metal thin films on customer-supplied or foundry-provided silicon wafers. These wafer-level deposition services support everything from early-stage MEMS process development and prototyping to high-precision device fabrication and volume production, all central to MEMS device fabrication.
Using advanced thin-film deposition technologies, our team tailors film composition, thickness, stress, and adhesion to meet the exact requirements of your MEMS design. PVD films can be deposited over thermal oxide or LPCVD films such as nitride and polysilicon. Whether you require silicon wafers with blanket metal layers, precision metal deposition for conductive interconnects, or diffusion barrier layers within a MEMS fabrication process, our flexible wafer processing capabilities deliver the consistency and precision required for high-performance microdevices.
With decades of experience in silicon wafer processing and MEMS fabrication, Rogue Valley Microdevices collaborates closely with customers to optimize deposition parameters for each application. The result is reliable electrical performance, excellent film adhesion, and repeatable wafer-level manufacturing results that support successful MEMS device development and production. For depositing films over PVD metal, please take a look at our PECVD film options.
Sputter Deposition
Quality matters. And we understand that. It’s why we’ve designed our sputter process to deposit ultra-clean metal and metal alloy films.
We add in-situ RF etch to the process to ensure good film adhesion and ohmic contact to underlying conductive layers. In addition to an in-situ RF etch, we can provide an HF-dip just prior to sputtering aluminum and aluminum alloy films. Adding this additional step can further increase ohmic contact between layers. PVD sputter deposition processing available on 50.8mm to 300mm silicon wafers and other materials.
Sputtered metal deposition is an omnidirectional process. This makes it a poor candidate for lift-off processing. But if you’re interested in metal for lift-off processing, you can rest easy. We offer E-beam evaporation as a solution, and our expertise extends to various MEMS fabrication requirements involving metals.
Films Options
- Titanium
- Chrome
- Aluminum
- Aluminum Copper
- Aluminum Silicon
- Copper
- Nickel
- Tantalum
- Tungsten
- Reactive Tantalum Oxide, Tantalum Nitride, and Titanium Nitride
Wafer Sizes
- 100mm wafers
- 150mm wafers
- 200mm wafers
- 300mm wafers
Wafer Materials
- Silicon
- Silicon on Insulator (SOI
- Quartz
- Sapphire
- Other specialty materials
E-Beam Evaporation Deposition
While most foundries won’t touch precious metals, we consider them a normal part of processing.
When your process requires precious metals deposition, E-beam evaporation provides an excellent choice for wafers that require lift-off processing. We’re experts at keeping the underlying wafer and photoresist cool during metal deposition, delivering the best possible results.
E-beam evaporation for MEMS fabrication ensures specialized results as we provide excellent film-thickness control and can deposit up to six different materials in-situ. While it’s almost impossible for most other foundries to achieve this level of control while depositing thick layers, we’ve developed a specialized time-tested low-temperature E-Beam evaporation process, specifically for use during metal lift-off processing. We offer E-Beam films on substrate diameters 100mm, 150mm, 200mm.
Learn more about our metal lift-off.
Film Options
- Aluminum
- Aluminum Oxide
- Chrome
- Copper
- Gold
- Indium
- Molybdenum
- Nickel
- Platinum
- Tin
- Titanium
- Silicon Oxide
- Silver
Wafer Sizes
- 100mm wafers
- 150mm wafers
- 200mm wafers
Wafer Materials
- Silicon
- Silicon on Insulator (SOI
- Quartz
- Sapphire
- Other specialty materials