Sputtered Metal Deposition
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We understand how important quality is to you. Our sputter process has been designed to deposit ultra-clean metal and dielectric films. All wafer processing, including metal deposition, is performed inside our class 100 cleanroom. An in-situ RF etch is added to the process to ensure good film adhesion and ohmic contact to underlying conductive layers.
In addition to an In-situ RF etch, we can provide an HF-dip just prior to sputtering aluminum and aluminum alloy films. Adding this additional step can further increase ohmic contact between layers.
Sputtered metal deposition is an omnidirectional process. For this reason, sputter deposition is not a good candidate for Lift-Off processing. If you are interested in metal for Lift-Off processing please see our E-beam evaporation metals page.
All sputter films are available on silicon wafers sizes up to 300mm in diameter. We can also provide sputtered films on non-silicon materials, including quartz and glass wafers.
We offer a wide variety of sputtered non-precious metals, dielectric films, and silicon. Precious metals are available for E-Beam evaporation.
Our Most Popular Sputtered Films Include:
- Titanium
- Chrome
- Aluminum
- Aluminum Copper
- Aluminum Silicon
- Copper
- Nickel
- Tantalum
- Tungsten
- Silicon
Sputtered Metal Deposition Specifications
- Thickness range: 100Å-1.5µm depending on metal
- Thickness tolerance: +/-10%
- Sides processed: One
- Wafer size: 2″ – 12″
- Gases: Argon, Nitrogen
- Equipment: Sputter deposition tool
