SPUTTERED METAL DEPOSITION

We understand how important quality is to you. Our sputter process has been designed to deposit ultra-clean metal and dielectric films. All wafer processing, including metal deposition, is performed inside our class 100 cleanroom. An in-situ RF etch is added to the process to insure good film adhesion and ohmic contact to underlying conductive layers.

In addition to an In-situ RF etch, we can provide an HF-dip just prior to sputtering aluminum and aluminum alloy films. Adding this additional step can further increase ohmic contact between layers.

Sputtered metal deposition is an omni-directional process. For this reason, sputter deposition is not a good candidate for Lift-Off processing. If you are interested in metal for Lift-Off processing please see our E-beam evaporation metals page.

All sputter films are available on silicon wafers sizes up to 300mm in diameter. We can also provide sputtered films on non-silicon materials, including quartz and glass wafers.

We offer a wide variety of sputtered non-precious metals, dielectric films, and silicon. Precious metals are available for E-Beam evaporation.sputtered metal deposition SputteredFilms-002

Our most popular Sputtered Films include:

  • Titanium
  • Chrome
  • Aluminum
  • Aluminum Copper
  • Aluminum Silicon
  • Copper
  • Nickel
  • Tantalum
  • Tungsten
  • Silicon

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Specifications

  • Thickness range: 100Å-1.5µm depending on metal
  • Thickness tolerance: +/-10%
  • Sides processed: One
  • Wafer size: 2″ – 12″
  • Gases: Argon, Nitrogen
  • Equipment: Sputter deposition tool
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