Metals

Whether you need a blanket metal film or a metal mask layer, we have your solution. Offering both PVD sputter and E-beam evaporation allows us to develop a custom process to meet your needs. Need a metal anneal? Include this in your request for a quote because we have metal anneal capabilities.

Choose Your Metal Deposition

Metal thin films are essential components in device-building. As such, they require precise deposition to avoid issues with ohmic contact, delamination, and circuit failure. We offer two different deposition types (PVD sputter and E-beam evaporation), giving us the flexibility to develop and optimize your process to ensure we meet your specific requirements.

We offer high-purity
ultra-clean metal deposition.”

PVD Sputter Metal Deposition

Quality matters. And we understand that. It’s why we’ve designed our sputter process to deposit ultra-clean metal and metal alloy films.

We add in-situ RF etch to the process to ensure good film adhesion and ohmic contact to underlying conductive layers. In addition to an in-situ RF etch, we can provide an HF-dip just prior to sputtering aluminum and aluminum alloy films. Adding this additional step can further increase ohmic contact between layers. PVD sputter deposition processing available on 50.8mm to 300mm substrates.

Sputtered metal deposition is an omnidirectional process. This makes it a poor candidate for lift-off processing. But if you’re interested in metal for lift-off processing, you can rest easy. We offer E-beam evaporation as a solution.

PVD Sputter Metal Films

  • Titanium
  • Chrome
  • Aluminum
  • Aluminum Copper
  • Aluminum Silicon
  • Copper
  • Nickel
  • Tantalum
  • Tungsten
  • Reactive Tantalum Oxide, Tantalum Nitride, and Titanium Nitride

E-Beam Evaporation Metal Deposition

While most foundries won’t touch precious metals, we consider them a normal part of processing.

When your process requires precious metals deposition, E-beam evaporation provides an excellent choice for wafers that require lift-off processing. We’re experts at keeping the underlying wafer and photoresist cool during metal deposition, delivering the best possible results.

Our E-beam evaporation process provides excellent film-thickness control and can deposit up to six different materials in-situ. While it’s almost impossible for most other foundries to achieve this level of control while depositing thick layers, we’ve developed a specialized time-tested low-temperature E-Beam evaporation process, specifically for use during metal lift-off processing. We offer E-Beam films on substrate diameters 100mm, 150mm, 200mm.

Learn more about our metal lift-off.

E-Beam Evaporation Metals

  • Aluminum
  • Aluminum Oxide
  • Chrome
  • Copper
  • Gold
  • Indium
  • Molybdenum
  • Nickel
  • Platinum
  • Tin
  • Titanium
  • Silicon Oxide
  • Silver