Spray Coat Photoresist
Spray coat technology works well for devices designed with high-aspect-ratio features that make it difficult to achieve conformal photoresist coverage using the standard spin coat method. It allows you to coat topographies with several microns of photoresist, making it ideal for fabricating 3D features, like V-grooves, deep trenches, silicon cavities, and through-silicon vias (TSVs). We offer positive, negative, and lift-off photoresists for spray coating. Available on 100mm, 150mm, and 200mm substrates.
Spin Coat Photoresist
The spin coat process allows us to deposit a thin uniform coat of either positive, negative, lift-off, or polyimide photoresist. Whether you need recipe development of a process for your device or a simple blanket coating for surface protection, we have the solution. Available on 100mm, 150mm, and 200mm substrates.