Spray and Spin Coat Resist

Whether your process demands a spray coat or spin coat on 100mm, 150mm, or 200mm substrates, our foundry checks all the boxes. The spray coat photoresist process is the better choice when topographies consist of high-aspect-ratio features that require conformal photoresist coverage. Deep trenches and silicon cavities used in MEMS devices are good examples.

When you only need a few microns of photoresist or your process demands blanket surface protection, go with spin coat photoresist. You can choose between spray coat and spin coat as part of process development or as a blanket film with a soft bake.

Spray Coat Photoresist

Spray coat technology works well for devices designed with high-aspect-ratio features that make it difficult to achieve conformal photoresist coverage using the standard spin coat method. It allows you to coat topographies with several microns of photoresist, making it ideal for fabricating 3D features, like V-grooves, deep trenches, silicon cavities, and through-silicon vias (TSVs). We offer positive, negative, and lift-off photoresists for spray coating. Available on 100mm, 150mm, and 200mm substrates.

Spin Coat Photoresist

The spin coat process allows us to deposit a thin uniform coat of either positive, negative, lift-off, or polyimide photoresist. Whether you need recipe development of a process for your device or a simple blanket coating for surface protection, we have the solution. Available on 100mm, 150mm, and 200mm substrates.

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