Thin Films Foundry – Manufacturing Process
Thin films are an important building block in any microelectronics manufacturing process. Having a diverse and flexible Thin Films tool box can greatly improve device function and manufacturability.
For an Optical Device, multilayer films stacks with the right refractive index is extremely important, while the mechanical properties of a film can determine the viability of a MEMS device.
For many Biomedical devices, gold, platinum and silver layers are essential to the function of the device.
Diverse Thin Film Offerings Commercially Available
Rogue Valley Microdevices thin films foundry maintains one the largest and most diverse thin film offerings commercially available. Many of our films can be customized to meet the specific Refractive Index, Film Stress, Resistivity and Crystallinity requirements for the device being manufactured.
All of our films are available for wafer sizes up to 200mm. Sputtered and PECVD films are available for wafer sizes up to 300mm. In order to support our growing customer base Rogue Valley Microdevices continues to add new films to our portfolio.
If your device utilizes a film that is not listed here, please contact us with your unique requirement.
- Standard Polysilicon
- Low Stress Polysilicon
- Silicon Dioxide
- Silicon Nitride
- Low Stress Silicon Nitride
- Silicon Carbide
- Silicon OxyNitride
- Carbon Doped Oxide
- Amorphous Silicon
- Multilayer film stacks can be deposited in situ without breaking vacuum
- Aluminum Copper
- Aluminum Silicon
- Reactively Sputtered Titanium Nitride
- Reactively Sputtered Tantalum Nitride
- Reactively Sputtered Tantalum Oxide
- Indium Tin Oxide
- Platinum Iridium
- Aluminum Oxide