Foundry Capabilities
We’re a solution-based foundry offering engineering process development expertise for MEMS and sensor applications. We have an extensive list of front-end process capabilities, and flexible tool sets that allow us to run 100mm, 150mm, and 200mm substrates.
As a customer-centric foundry, we’re dedicated to meeting your needs. We start your fabrication on a small diameter, with the capability to ramp to 200mm as your volumes increase. This makes us the perfect choice if you’re scaling your output.
What if you need to go to high-volume or you need a second source? We honor that process and will work with you on tech transfer to your high-volume foundry. We’ll also go with you hand-in-hand if you need to establish a second source for your low-volume production.
When you work with us, your goals are our goals. And your success is ours.
Photolithography
Contact and Proximity Alignment for large features (5µm and greater). Stepper is available on 150mm substrate for features that need 2µm.
Resist Coating
Positive, negative, lift-off, and polyimide photoresist solutions to meet your requirements, including spin coat and spray coat.
Metal Lift-Off
A solution for materials sensitive to etching.
Etching
We offer a variety of etch types to meet your requirements, including DRIE, wet silicon etch, dry passivation etch, and wet etch metal and dielectric.