Photoresist Spray Coat Technology

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Made commercially available in early 2000, spray coating has many advantages. MEMS Devices are often designed with high aspect ratio features making it difficult to achieve conformal photoresist coverage using the standard spin coat method. Spray coat technology allows you to coat topographies ranging from a few microns to a few hundred microns making it ideal for fabricating 3D features, like V-grooves, deep trenches, silicon cavities, and through-silicon vias (TSVs).

Our photoresist spray coat process is a great alternative to spin coat and can be adapted to meet your specific needs. In addition to integrating this unique capability into our MEMS fabrication modules, we also provide spray coat as a stand-alone process.

holding silicon wafer inside cleanroom
A hi-tech industry engineer in white gloves holding a silicon wafer inside a cleanroom lab.

About the equipment:

Karl Suss ACS200 Coater Features

  • Gyrset spin coater – 3 resist dispense pumps/nozzles (2 high viscosity 1 low viscosity)
  • Acqueous develop module
  • 13 standard hotplates
  • 1 vapor prime hotplate
  • 2 mechanical center stations
  • Genmark robot
  • Spray coater upgrade – (2 spray dispense pumps/nozzles)

Spray Coat Unique Capabilities

  • Enabling technology for patterning across severe topography
  • Conformal coating with top edge coverage while avoiding resists accumulation in trenches
  • Proprietary spray design for optimal process stability and reproducibility