PRD1026 – 100mm DSP Silicon Wafers 1um Low Stress LPCVD Nitride

$2,876.25

Product ID: PRD1026
Substrate: Silicon Wafers
Diameter: 100mm
Type/Dopant: P/Boron
Orientation: <100>
Resistivity: 1-20 Ohm-cm
Thickness: 525 +/- 25um
Front Side: Polished
Back Side: Polished
Film: 1um +/- 5% Low Stress LPCVD Nitride


All Sales are Final.  RVM Terms and Conditions Apply
Shipping PP&A.  Lead time 1 week

2 in stock (can be backordered)

SKU: PRD1026 Categories: ,

Description

Our Low Stress Nitride can be used for Membranes, Cantilever Beams, and other mechanical structures associated with MEMS devices. This Silicon Rich Film is excellent as a KOH Etch Mask.  All silicon wafers have been thoroughly inspected and receive a pre-furnace clean prior to LPCVD Nitride deposition.  All orders are sent with a Certificate of Conformance containing wafer specifications and Nitride film thickness data.

100mm DSP Silicon Wafers 1um Low Stress Nitride Parameters

Thickness 9,500Å – 10,500Å
Thickness Tolerance +/-5%
Sides Pressed Both
Refractive Index 2.20 +/-0.05 @ 632.8nm
Film Stress <250MPa +/-50MPa Tensile Stress
Wafer Material Silicon, Silicon on Insulator
Wafer Thickness Std. Thickness
Temperature ~820C°
Gases Dichlorosilane, Ammonia
Equipment Horizontal Furnace

 

 

Additional information

Diameter

Type/Dopant

Orientation

Resistivity

Surface

Film