PRD1016 – 100mm Silicon Wafers 3,000A Low Stress LPCVD Nitride


Product ID: PRD1016
Substrate: Silicon Wafers
Diameter: 100mm
Type/Dopant: P/Boron
Orientation: <100>
Resistivity: 1-30 Ohm-cm
Thickness: 525 +/- 25um
Front Side: Polished
Back Side: Etched
Film: 3000A +/- 5% Low Stress LPCVD Nitride

All Sales are Final.  RVM Terms and Conditions Apply
Shipping PP&A.  Lead time 1 week

1 in stock (can be backordered)

SKU: PRD1016 Categories: ,


Our Low Stress Nitride can be used for Membranes, Cantilever Beams and other mechanical structures associated with MEMS devices. This Silicon Rich Film is excellent as a KOH Etch Mask.

All Silicon wafers have been thoroughly inspected and receive a pre-furnace clean prior to LPCVD Nitride deposition.  All orders are sent with a Certificate of Conformance containing wafer specifications and Nitride film thickness data.


100mm Silicon Wafers 3,000A Low Stress Nitride Parameters

Thickness 2,950Å – 3,150Å
Thickness Tolerance +/-5%
Sides Pressed Both
Refractive Index 2.20 +/-0.05 @ 632.8nm
Film Stress <250MPa +/-50MPa Tensile Stress
Wafer Material Silicon, Silicon on Insulator
Wafer Thickness Std. Thickness
Temperature ~820C°
Gases Dichlorosilane, Ammonia
Equipment Horizontal Furnace



Additional information