Description
Our Low Stress Nitride can be used for Membranes, Cantilever Beams, and other mechanical structures associated with MEMS devices. This Silicon Rich Film is excellent as a KOH Etch Mask. All silicon wafers have been thoroughly inspected and receive a pre-furnace clean prior to LPCVD Nitride deposition. All orders are sent with a Certificate of Conformance containing wafer specifications and Nitride film thickness data.
100mm Silicon Wafers 6,000A Low Stress Nitride Parameters |
|
| Thickness | 5,700Å – 6,300Å |
| Thickness Tolerance | +/-5% |
| Sides Pressed | Both |
| Refractive Index | 2.20 +/-0.05 @ 632.8nm |
| Film Stress | <250MPa +/-50MPa Tensile Stress |
| Wafer Material | Silicon, Silicon on Insulator |
| Wafer Thickness | Std. Thickness |
| Temperature | ~820C° |
| Gases | Dichlorosilane, Ammonia |
| Equipment | Horizontal Furnace |
