Our Low Stress Nitride can be used for Membranes, Cantilever Beams and other mechanical structures associated with MEMS devices. This Silicon Rich Film is excellent as a KOH Etch Mask. All Silicon wafers have been thoroughly inspected and receive a pre-furnace clean prior to LPCVD Nitride deposition. All orders are sent with a Certificate of Conformance containing wafer specifications and Nitride film thickness data.
Low Stress Nitride Parameters
|Thickness||5,700Å – 6,300Å|
|Refractive Index||2.20 +/-0.05 @ 632.8nm|
|Film Stress||<250MPa +/-50MPa Tensile Stress|
|Wafer Material||Silicon, Silicon on Insulator|
|Wafer Thickness||Std. Thickness|